LOC/CSP Die Bonder (DIH1000 Vision Inspection)

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LOC/CSP Die Bonder

DNC Engineering Co., Ltd.
[Korea]

Address:
107, Anyangmegavally, 799, Gwanyang-dong, Dongan-gu Anyang-si Gyeonggi-do 431-060 Korea

Phone:
82-31-4205700

Contact name:
Kyoungwook Kim , Managing Director

LOC/CSP Die Bonder

	LOC/CSP Die Bonder (DIH1000 Vision Inspection)

LOC/CSP Die Bonder (DIH1000 Vision Inspection)

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DDB1000 is fully automatic vision systems performing high-speed 3D inspection on the device and its designed based on the most demanding requirements, offering superior performance in a compact, sturdy and cost effective 3D Vision Inspection system forsemiconductor devices inspects such as lead co-planarity, lead offset, lead skew, lead pitch, lead span, terminal dimension , lead width, body stand-off and foot angle.