LOC/CSP Die Bonder (DB3000 LOC/CSP Die Bonder)

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LOC/CSP Die Bonder

DNC Engineering Co., Ltd.
[Korea]

Address:
107, Anyangmegavally, 799, Gwanyang-dong, Dongan-gu Anyang-si Gyeonggi-do 431-060 Korea

Phone:
82-31-4205700

Contact name:
Kyoungwook Kim , Managing Director

LOC/CSP Die Bonder

	LOC/CSP Die Bonder (DB3000 LOC/CSP Die Bonder)

LOC/CSP Die Bonder (DB3000 LOC/CSP Die Bonder)

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DB3000 is designed on te semi-standard up to 12inch wafers, is built for the most demanding requirements, offering superior performance and flexibility in a compact size, sturdy and cost effective Die bonder for LOC (Lead On Chip) packaging process with lead frame substrate and CSP(Chip Scale Packaging) process with film or PWB substrate.